239000000758 substrate Substances 0.000 claims description 8.238000004519 manufacturing process Methods 0.000 claims description 8.230000000875 corresponding Effects 0.000 claims description 12.238000003776 cleavage reaction Methods 0.000 claims abstract description 32.Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Priority to US07/439,920 priority Critical patent/US4997793A/en Application filed by Eastman Kodak Co filed Critical Eastman Kodak Co Priority to US07/662,866 priority patent/US5053836A/en Application granted granted Critical Publication of US5053836A publication Critical patent/US5053836A/en Anticipated expiration legal-status Critical Status Expired - Fee Related legal-status Critical Current Links Original Assignee Eastman Kodak Co Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) McClurg Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Expired - Fee Related Application number US07/662,866 Inventor Scott D.
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Google Patents Cleaving of diode arrays with scribing channelsĭownload PDF Info Publication number US5053836A US5053836A US07/662,866 US66286691A US5053836A US 5053836 A US5053836 A US 5053836A US 66286691 A US66286691 A US 66286691A US 5053836 A US5053836 A US 5053836A Authority US United States Prior art keywords diode wafer sites scribing array Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US5053836A - Cleaving of diode arrays with scribing channels
US5053836A - Cleaving of diode arrays with scribing channels
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